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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* High Intensity. * Popular T-1 3/4 diameter Package. * Selected minimun intensities. * General purpose leads. * Reliable and rugged.
Package Dimensions
Part No.
LTL-4223-032A
Lens
Red Diffused
Source Color
Hi-Eff.Red
Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.25mm(.010") unless otherwise noted. 3. Protruded resin under flange is 1.0mm(.04") max. 4. Lead spacing is measured where the leads emerge from the package. 5. Specifications are subject to change without notice. Part No. : LTL-4223-032A BNS-OD-C131/A4 Page : 1 of 8
LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Absolute Maximum Ratings at TA=25
Parameter Power Dissipation Peak Forward Current (1/10 Duty Cycle, 0.1ms Pulse Width) Continuous Forward Current Derating Linear From 50 Reverse Voltage Operating Temperature Range Storage Temperature Range Lead Soldering Temperature [1.6mm(.063") From Body] Maximum Rating 100 120 30 0.4 5 -55 to + 100 -55 to + 100 260 for 5 Seconds Unit mW mA mA mA/ V
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Electrical / Optical Characteristics at TA=25
Parameter Luminous Intensity Viewing Angle Peak Emission Wavelength Dominant Wavelength Spectral Line Half-Width Forward Voltage Reverse Current Capacitance Symbol IV 21/2 P d VF IR C 20 Min. 5.6 Typ. 19 36 635 623 40 2.0 2.6 100 Max. Unit mcd deg nm nm nm V A pF IF = 20mA VR = 5V VF = 0 , f = 1MHz Test Condition IF = 10mA Note 1,4 Note 2 (Fig.6) Measurement @Peak (Fig.1) Note 3
Note: 1. Luminous intensity is measured with a light sensor and filter combination that approximates the CIE (Commission International De L'Eclairage) eye-response curve. 2. 1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength, d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. The Iv guarantee should be added 15% .
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Typical Electrical / Optical Characteristics Curves
(25 Ambient Temperature Unless Otherwise Noted)
Part No. : LTL-4223-032A BNS-OD-C131/A4
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
Features
* Compatible with radial lead automatic insertion equipment. * Most radial lead plastic lead lamps available packaged in tape and folding. * 5mm (0.197") formed lead spacing available. * Folding packaging simplifies handling and testing.
Package Dimensions
Specification
Item
Tape Feed Hole Diameter Component Lead Pitch Front to Rear Deflection Feed Hole to Bottom of Component Feed Hole to Overall Component Height Lead Length After Component Height Feed Hole Pitch Lead Location Center of Component Location Total Tape Thickness Feed Hole Location Adhesive Tape Width Adhesive Tape Position Tape Width
Symbol D F H H1 H2 L P P1 P2 T W0 W1 W2 W3
Minimum mm 3.8 2.3 -20.0 28.3 12.4 4.4 5.05 -8.5 14.5 0 17.5 inch 0.149 0.091 -0.787 1.114 W0 0.488 0.173 0.198 -0.334 0.571 0 0.689
Maximum mm 4.2 3.0 2.0 21.0 29.9 11.0 13.0 5.8 7.65 0.90 9.75 15.5 3.0 19.0 inch 0.165 0.118 0.078 0.827 1.177 0.433 0.511 0.228 0.301 0.035 0.384 0.610 0.118 0.748
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
CAUTIONS
1. Application
The LEDs described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household applications).Consult Liteon's Sales in advance for information on applications in which exceptional reliability is required, particularly when the failure or malfunction of the LEDs may directly jeopardize life or health (such as in aviation, transportation, traffic control equipment, medical and life support systems and safety devices).
2. Storage
The storage ambient for the LEDs should not exceed 30C temperature or 70% relative humidity. It is recommended that LEDs out of their original packaging are used within three months. For extended storage out of their original packaging, it is recommended that the LEDs be stored in a sealed container with appropriate desiccant or in desiccators with nitrogen ambient.
3. Cleaning
Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LEDs if necessary.
4. Lead Forming & Assembly
During lead forming, the leads should be bent at a point at least 3mm from the base of LED lens. Do not use the base of the lead frame as a fulcrum during forming. Lead forming must be done before soldering, at normal temperature. During assembly on PCB, use minimum clinch force possible to avoid excessive mechanical stress.
5. Soldering
When soldering, leave a minimum of 2mm clearance from the base of the lens to the soldering point. Dipping the lens into the solder must be avoided. Do not apply any external stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering conditions : Soldering iron Temperature Soldering time 300C Max. 3 sec. Max. (one time only) Wave soldering Pre-heat Pre-heat time Solder wave Soldering time 100C Max. 60 sec. Max. 260C Max. 10 sec. Max.
Note: Excessive soldering temperature and/or time might result in deformation of the LED lens or catastrophic failure of the LED
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
6. Drive Method
An LED is a current-operated device. In order to ensure intensity uniformity on multiple LEDs connected in parallel in an application, it is recommended that a current limiting resistor be incorporated in the drive circuit, in series with each LED as shown in Circuit A below.
Circuit model A
LED
Circuit model B
LED
(A) Recommended circuit (B) The brightness of each LED might appear different due to the differences in the I-V characteristics of those LEDs
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LITE-ON TECHNOLOGY CORPORATION
Property of Lite-On Only
7. Reliability Test
Classification Test Item Test Condition
Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1000HRS (-24HRS,+72HRS) Ta= 655 RH= 90 95% Test Time= 240HRS2HRS Ta= 655 RH= 90 95% VR=5V Test Time = 500HRS (-24HRS, +48HRS) Ta= 1055 *Test Time= 1000HRS (-24HRS,+72HRS)
Reference Standard
MIL-STD-750D:1026 (1995) MIL-STD-883D:1005 (1991) JIS C 7021:B-1 (1982) MIL-STD-202F: 103B(1980) JIS C 7021 : B-11(1982)
Operation Life
High Temperature High Humidity Storage
Endurance Test
High Temperature High Humidity Reverse BIAS High Temperature Storage
JIS C 7021 : B-11(1982)
MIL-STD-883D:1008 (1991) JIS C 7021:B-10 (1982)
Low Temperature Storage
Ta= -555 *Test Time=1000HRS (-24HRS,+72HRS) 105 25 -55 25 30mins 5mins 30mins 5mins 10 Cycles 105 5 -55 5 10mins 10mins 10 Cycles T.sol = 260 5 Dwell Time= 10 1secs
JIS C 7021:B-12 (1982) MIL-STD-202F:107D (1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1010 (1991) JIS C 7021: A-4(1982) MIL-STD-202F:107D(1980) MIL-STD-750D:1051(1995) MIL-STD-883D:1011 (1991) MIL-STD-202F:210A(1980) MIL-STD-750D:2031(1995) JIS C 7021: A-1(1982) MIL-STD-202F:208D(1980) MIL-STD-750D:2026(1995) MIL-STD-883D:2003(1991) JIS C 7021: A-2(1982)
Temperature Cycling
Environmental Test
Thermal Shock
Solder Resistance
Solderability
T. sol = 230 5 Dwell Time= 5 1secs
8. Others
The appearance and specifications of the product may be modified for improvement, without prior notice.
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